| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a silicone rubber adhesive composition easily moldable in a short time by means of injection molding, suitable for primerless molding and exhibiting excellent adhesion to a thermoplastic resin and to provide an integrally molded body, which is useful in electric, electronic, automobile, precision machinery and building industries and the like, of the silicone rubber adhesive composition and a thermoplastic resin bonded thereto without modifying the thermoplastic resin. SOLUTION: The silicone rubber adhesive composition comprises (A) 100 pts.wt. of a heat-curable organopolysiloxane composition, (B) 1-100 pts.wt. of a reinforcing silica fine powder and (C) 0.1-50 pts.wt. of an organic compound having at least one aromatic ring in the molecule or an organosilicon compound, each having an epoxy equivalent of 100-5,000 g/1 mole.</p> |
