发明名称 Diamond film depositing apparatus and method thereof
摘要 A diamond film depositing apparatus and method are disclosed in which a uniform and large plasma is formed on a substrate having a diameter of larger than 100 mm without using a heated filament cathode, without applying a magnetic field thereto, and without using a ballast resistance. The thusly formed plasma is maintained stably for a long time, so that a diamond thick film having a diameter of larger than 4 inches and a thickness of over hundreds of mum can be deposited on a flat or curved substrate and also on a Si wafer.
申请公布号 US2002110648(A1) 申请公布日期 2002.08.15
申请号 US20020122459 申请日期 2002.04.15
申请人 KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY 发明人 LEE WOOK-SEONG;BAIK YOUNG JOON;EUN KWANG YONG
分类号 H01L21/208;C23C16/00;C23C16/26;C23C16/27;C23C16/32;C23C16/50;H01J37/32;H01L21/31;H01L21/469;H05H1/24;(IPC1-7):C23C16/00 主分类号 H01L21/208
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