| 摘要 |
PROBLEM TO BE SOLVED: To provide an image sensor, in which even if there are provided many sensor elements, the respective sensor elements can be readily connected electrically with an amplifier IC and which has a high sensitivity, and to provide its manufacturing method. SOLUTION: A plurality of sensor elements made of CdTe are arranged into a two-dimensional matrix to form a sensor matrix array 11, which is mounted on an IC substrate 15 via a connection layer 13, to form an image sensor with a three-dimensional structure. The connection layer 13 has a plurality of stud bumps 130, which are formed in the connection layer 13 on the respective electrodes of the IC, in order to draw out signals detected by the respective sensor elements into the IC, and a plurality of thin film layers 112, which are formed on the tips of the respective stud bumps 130 and are connected electrically with electrodes of the respective sensor elements. |
