发明名称 SPUTTERING TARGET MATERIAL OF HIGH MELTING POINT ELEMENT, AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a sputtering target material of a high melting point element, which is made from any element of Re, Hf, Sc and Ge, and has a high density, a high purity and a fine crystal structure, and to provide a manufacturing method therefor. SOLUTION: The method for manufacturing the sputtering target material of the high melting point element with an adequate yield comprises sintering the raw powder of any high melting point element of Re, Hf, Sc and Ge with a powder metallurgy process by using discharge plasma to densify the powder, at a sintering retention temperature of 800-1,800°C and in a sintering retention period of 20-60 minutes. Thus-manufactured sputtering target material has the structure consisting of fine crystal grains with a diameter of 10 to 300μm, a purity of 99.5 wt.% or higher, and a relative density ratio of 99.0% or higher with respect to a theoretical density. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004359976(A) 申请公布日期 2004.12.24
申请号 JP20030156635 申请日期 2003.06.02
申请人 NEC TOKIN CORP 发明人 MATSUMOTO HIROYUKI;FUJIWARA TERUHIKO
分类号 B22F3/14;C22C1/04;C22C27/00;C22C28/00;C23C14/34;G11B7/26;(IPC1-7):B22F3/14 主分类号 B22F3/14
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