发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device comprising a high dielectric constant oxide insulating film which functions as a gate insulating film and has a reduced silicon oxide converted film thickness, a small hysteresis, and a small shift in a flat band voltage (ΔVfb). SOLUTION: A semiconductor device comprises: a silicon substrate; a silicon oxide layer formed on the surface of the silicon substrate; a first oxide layer which is composed of a high dielectric constant film having a dielectric constant higher than that of a silicon oxide and is formed above the silicon oxide layer; a first nitride layer which is formed above the first oxide layer and made of nitride having oxygen intercepting capability; and a gate electrode formed above the first nitride layer. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005210060(A) |
申请公布日期 |
2005.08.04 |
申请号 |
JP20040238211 |
申请日期 |
2004.08.18 |
申请人 |
FUJITSU LTD |
发明人 |
SAKOTA TSUNEHISA;SUGIYAMA YOSHIHIRO;YAMAGUCHI MASAOMI;NAMIKATA HIROSHI |
分类号 |
H01L23/52;H01L21/316;H01L21/3205;H01L21/8238;H01L27/092;H01L29/78;(IPC1-7):H01L29/78;H01L21/320;H01L21/823 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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