发明名称 LAMINATION CHIP ELECTRONIC COMPONENT, UNIT THEREFOR, AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a lamination chip electronic component wherein shortage of mutual internal electrodes is not generated even when cracks are generated in a green sheet, a unit for the lamination chip electronic component, and its manufacturing method. SOLUTION: In the unit for the lamination chip electronic component, a configuration is installed wherein a plurality of sheet type members are laminated which have second electric property and are provided with members of a predetermined pattern profile which have first electric property. A plurality of the sheet type members are laminated, and the lamination chip electronic component is constituted. In the lamination chip electronic component, at the time of formation of the unit for the lamination chip electronic component, thickness of one sheet type member which is in contact with a surface of a temporary base mount on which a plurality of the sheet type members are laminated is greater than thickness of other sheet type members. The unit for the lamination chip electronic component and its manufacturing method are provided. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005209915(A) 申请公布日期 2005.08.04
申请号 JP20040015409 申请日期 2004.01.23
申请人 TDK CORP 发明人 SHINDO HIROSHI;TAKAHASHI MAKOTO;YAGI HIROSHI
分类号 H01G4/12;H01G4/30;(IPC1-7):H01G4/12 主分类号 H01G4/12
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