| 摘要 |
A semiconductor leadframe assembly (20A) and a method for manufacturing a semiconductor component (50) using the semiconductor leadframe assembly (20A). The semiconductor leadframe assembly (20A) includes a leadframe (10A) having flag portions (18A), lead portions (19A), and vias (14A). The vias (14A) serve as dielectric receiving areas. The assembly (20A) further includes semiconductor chips (21A) mounted on the flag portions (18A) and a dielectric material (33A) that covers the semiconductor chips (21A) and fills the vias (14A). The surface mount semiconductor component (50) is singulated from the semiconductor leadframe assembly (20A) to form electrical interconnects (18, 19) of the surface mount semiconductor component (50). |
