发明名称 POLYAMIDE RESIN COMPOSITION FOR LASER MARKING AND LASER-MARKED POLYAMIDE RESIN MOLDING
摘要 <P>PROBLEM TO BE SOLVED: To provide a polyamide resin composition which is improved in flame retardance and laser markability while retaining the moldability, mechanical properties, thermal stability, heat resistance, and electrical characteristics inherent in a polyamide resin; and moldings for laser marking, which are made by molding the composition. <P>SOLUTION: The polyamide resin composition for laser marking comprises 100 parts by weight of a polyamide resin and 0.1 to 100 parts by weight of a halogen-containing organic compound and/or an antimony compound, and is characterized in that when the molding of the composition is marked by irradiation with laser, the color of the formed mark is darker than that of the non-irradiated surface areas of the molding. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007098939(A) 申请公布日期 2007.04.19
申请号 JP20060219591 申请日期 2006.08.11
申请人 MITSUBISHI ENGINEERING PLASTICS CORP 发明人 TSUNODA MORIO;YAMANAKA YASUSHI;SUZUKI MASAMI
分类号 B41M5/26;B41M5/382;B41M5/46;C08K3/22;C08L77/00 主分类号 B41M5/26
代理机构 代理人
主权项
地址