| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve a high precision, highly reliable and inexpensive module substrate having a highly heat dissipating structure, and a wide application range. <P>SOLUTION: A light source comprises a heat dissipating substrate, an insulating layer formed in a partial region on the upper surface of the heat dissipating substrate, a plurality of wiring layers arranged on the insulating layer, and a plurality of LED devices connected to the wiring layers. Further, the light source comprises a heat dissipating substrate, an insulating layer arranged in a partial region on the upper surface of the heat dissipating substrate, a plurality of wiring layers having wiring patterns formed therein which are arranged on the insulating layer, and a plurality of LED devices connected to the wiring layers. The insulating layer consists of two layers comprising a resin layer arranged on the side of the wiring layers, and an adhesive layer on the side of the heat dissipating substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT |
