发明名称 BAND SAW
摘要 PROBLEM TO BE SOLVED: To provide a band saw which can smoothly perform discharge of chips or supply of polishing liquid, obtains excellent cutting sharpness, reduces machining damage to a workpiece, and obtains excellent surface roughness. SOLUTION: The band saw 100 includes a plurality of abrasive layer fixed to a base metal at an interval, and is equipped with a band like flat shape base metal 1; a first blade part 11 which is provided on one side of two end edge parts 1E, 1F extending to the longitudinal direction of the base metal, and is fixed with a first abrasive layer 11A having a first cutting edge width w<SB>1</SB>on the front surface 1S and a back surface 1T of the base metal 1; a second blade part 12 which is provided on the one end part 1E having the first blade part 11 adjacent to the first blade part 11, and is fixed with a second abrasive layer 12A having a second cutting edge width w<SB>2</SB>different from the first cutting edge width w<SB>1</SB>on the front surface 1S and the back surface 1T of the base metal 1. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008044018(A) 申请公布日期 2008.02.28
申请号 JP20060218564 申请日期 2006.08.10
申请人 ASAHI DIAMOND INDUSTRIAL CO LTD 发明人 TAKANO SEIJU
分类号 B23D61/18;B23D61/12;B24D11/06;B24D99/00 主分类号 B23D61/18
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