Method and apparatus for image sensor packaging

摘要

Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a sensor device with an application specific integrated circuit (ASIC) are disclosed. According to an embodiment, a sensor device may be bonded together face-to-face with an ASIC without using a carrier wafer, where corresponding bond pads of the sensor are aligned with bond pads of the ASIC and bonded together, in a one-to-one fashion. A column of pixels of the sensor may share a bond bad connected by a shared inter-metal line. The bond pads may be of different sizes and configured in different rows to be disjoint from each other. Additional dummy pads may be added to increase the bonding between the sensor and the ASIC.

主权项

1. A sensor device, comprising:
a substrate with a front side and a backside, the front side having a first surface area; a first column of pixels comprising a first pixel and a second pixel within the substrate; a first bond pad located at a top metal layer at the front side of the substrate connected to the first pixel and the second pixel by a first inter metal line, the first inter metal line extending in a first direction; a second bond pad located at the top metal layer; a plurality of dummy pads on the front side of the substrate, the plurality of dummy pads having a cumulative surface area of less than about 40% of the first surface area, at least one dummy pad being interjacent the first bond pad and the second bond pad; and a through via extending through the substrate and electrically connecting the second bond pad to a contact disposed on the backside of the substrate.