发明名称 |
ELECTROLESS PLATING METHOD AND CERAMIC SUBSTRATE |
摘要 |
Provided is an electroless plating method for a low temperature co-fired glass ceramic substrate, the method including: a degreasing and activation treatment step of degreasing and activating a surface of a wiring pattern formed of a silver sintered body; a catalyzing step of providing a catalyst onto the surface of the wiring pattern formed of a silver sintered body; and an electroless multi-layered coating plating treatment step. The electroless plating method further includes, between the degreasing and activation treatment step and the catalyzing step, a silver precipitation treatment step of precipitating silver on a glass component present on the surface of the wiring pattern formed of a silver sintered body after the degreasing and activation treatment step, and the catalyzing step includes providing the catalyst also to the silver precipitated in the silver precipitation treatment step. |
申请公布号 |
HK1213301(A1) |
申请公布日期 |
2016.06.30 |
申请号 |
HK20160101084 |
申请日期 |
2016.01.29 |
申请人 |
MITSUBISHI ELECTRIC CORPORATION |
发明人 |
TAKEMOTO, YOHEI;SEKINO, SHIRO;KAIHATSU, YUTA;YAMANAKA, HIROMI |
分类号 |
C23C |
主分类号 |
C23C |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|