| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module which prevents abnormality such as cracks from occurring in a connection conductor and also prevents the damage of a semiconductor chip which is caused by thermal fatigue.SOLUTION: A power module 1 according to this invention comprises: a first substrate 2 where a first metal wiring layer 3 is provided on a surface, the first substrate 2 made of a ceramic material; a second substrate 4 where a second metal wiring layer 5, which is disposed facing the first metal wiring layer 3, is provided on a surface, the second substrate 4 made of a ceramic material; and a semiconductor chip 6 where a front surface side electrode is connected with the second metal wiring layer 5 by solder and a rear surface side electrode is connected with the first metal wiring layer 3 by solder. An epoxy resin 11 fills a space between the first substrate 2 and the second substrate 4. |
