发明名称 FILM DEPOSITION METHOD AND FILM DEPOSITION APPARATUS
摘要 PROBLEM TO BE SOLVED: To solve the problem that it is difficult to prevent the film quality of a film to be deposited from being deteriorated when vacuum-deposited by a batch system using a vapor deposition material in a solution state.SOLUTION: A film deposition method using an apparatus including: a film deposition chamber 10 having a distributor 25 inside; and supply chambers (21a and 21b) communicated through partition parts (24a and 24b) openable and closable to the distributor; and vapor deposition material receiving parts (31a and 31b) provided so as to move from below vapor deposition material solution supply parts (30a and 30b) to the inside of the distributor in the supply chambers comprises: evacuating the film deposition chamber in the state of closing the partition parts; supplying vapor deposition material solutions to the vapor deposition material receiving parts; removing the solvents of the vapor deposition material solutions by evacuating the supply chambers; opening the partition parts to communicate the supply chambers with the distributor; moving the vapor deposition material receiving parts inside the distributor; evaporating the vapor deposition materials of the vapor deposition material receiving parts by heating the distributor to deposit a film on a film deposition substrate.SELECTED DRAWING: Figure 2
申请公布号 JP2016125135(A) 申请公布日期 2016.07.11
申请号 JP20150014228 申请日期 2015.01.28
申请人 OPTORUN CO LTD 发明人 WATANABE MASARU;HAN HIN;SHIMADA SHUICHI
分类号 C23C14/24;G02B1/10 主分类号 C23C14/24
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