Wafer releasing

摘要

Embodiments of the present invention provide a chuck system for handling a wafer that comprises a first and a second main surface. The chuck system includes a chuck configured to hold the wafer at the second main surface facing the chuck and a release device. The chuck system further includes an actuator configured to lift the release device away from the chuck. The release device is configured such that the release device mechanically engages with the wafer at an edge portion of the second main surface of the wafer when being lifted, thereby releasing the wafer from the chuck.

主权项

1. A chuck system for handling a wafer comprising a first and a second main surface, the chuck system comprising:
a chuck configured to hold the wafer at the second main surface facing the chuck; a release device; an actuator configured to lift the release device away from the chuck, wherein the release device is configured such that the release device mechanically engages with the wafer at an edge portion of the second main surface of the wafer when being lifted thereby releasing the wafer from the chuck; an edge protection device configured to protect an edge portion of the first main surface against an environment of the chuck and configured to move between a first state at which the edge protection device covers the edge portion of the first main surface of the wafer and a second state at which the edge protection device is lifted away from the edge portion of the first main surface; and a lift member for carrying the edge protection device, the lift member comprising a catch, wherein the actuator is configured to lift the lift member in order to lift the edge protection device and move the edge protection device from the first state to the second state, and continue to lift the lift member so that the catch engages with the release device releasing the release device from the chuck.