发明名称 SILVER PLATING MATERIAL AND METHOD FOR PRODUCING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a silver plating material capable of preventing the increase of contact resistance while maintaining high hardness, and a method for producing the same.SOLUTION: In a silver plating liquid including silver of 80 to 110 g/L, potassium cyanide of 70 to 160 g/L and selenium of 55 to 70 mg/L, electroplating is performed in such a manner that liquid temperature is 10 to 35°C, current density is 3 to 15 A/dm, and, provided that the product between the concentration of the potassium cyanide in the silver plating liquid and the current density is defined as (g A/L dm), the liquid temperature is defined as x(°C), (32.6x-300)≤y≤(32.6x+200) is controlled, and a surface layer made of silver is formed on the stock to produce a silver plating material.SELECTED DRAWING: Figure 1
申请公布号 JP2016145413(A) 申请公布日期 2016.08.12
申请号 JP20150254654 申请日期 2015.12.25
申请人 DOWA METALTECH KK 发明人 SADAMORI TOSHIKI;MIYAZAWA HIROSHI;OGATA MASAFUMI;SHINOHARA KEISUKE
分类号 C25D3/46;C25D7/00 主分类号 C25D3/46
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