发明名称 Electronic apparatus
摘要 According to one embodiment, an apparatus includes a board, a module, cables, and an insulator. The module includes a module body having a first end portion protruding to form a step and module terminals attached to the first end portion. The first end portion is thinner than a main portion of the module body. The protrusion height of the module terminal is less than that of the step. The cables have cable terminals fixed to the module terminals. The insulator has a first adhesive portion adhered to an adhesive point arranged on the back side to the first surface opposite to the board, a second adhesive portion adhered to the first surface, and a cover portion continued to the second adhesive portion and covering the cable terminal between both adhesive portions.
申请公布号 US9448590(B2) 申请公布日期 2016.09.20
申请号 US201414330792 申请日期 2014.07.14
申请人 Kabushiki Kaisha Toshiba 发明人 Hirai Yuichi;Koide Shingo
分类号 G06F1/16 主分类号 G06F1/16
代理机构 Rutan & Tucker, LLP 代理人 Rutan & Tucker, LLP ;Schaal William W.
主权项 1. An electronic apparatus comprising: a first housing; a printed wiring board accommodated in the first housing; a module arranged on the printed wiring board, the module comprising a module body having a first end portion protruding to form a step and a plurality of module terminals attached to the first end portion, the first end portion being thinner than a main portion of the module body, a protrusion height of the module terminal to the first end portion being less than a height of the step; a plurality of cables having cable terminals fixed to the module terminals; and a bendable sheet-shaped insulator having a first adhesive portion, a second adhesive portion and a cover portion, the first adhesive portion adhered to an adhesive point located on a back side to a first surface opposite to the printed wiring board of the module body, the second adhesive portion adhered to the first surface, the cover portion continued to the second adhesive portion and covering each of the cable terminals between the first adhesive portion and the second adhesive portion.
地址 Tokyo JP