Method and system for optimized automated IC package pin routing

摘要

An automated method and system is disclosed to determine an Integrated Circuit (IC) package interconnect routing using a mathematical topological solution. A global topological routing solution is determined to provide an IC package routing solution. The global topological solution is used in conjunction with necessary design parameters to determine the optimal geometric routing solution which can include reassignment of IC nets and/or pin assignments and/or relocation of IC nets.