| 摘要 |
1,263,714. Soldering. JOSEPH LUCAS (INDUSTRIES) Ltd. 25 June, 1969 [19 July, 1968], No. 34498/68. Heading B3R. [Also in Division H1] Apparatus for soldering the leads 29 of a plurality of diodes carried by the terminal plates 23, 24, 25 of a full wave rectifier assembly to a plurality of phase plates 26a, 26b etc. of the assembly includes a reservoir 11 for molten solder 12, an open ended container 13 in the reservoir through which container molten solder 12 is circulated upwardly, a cup shaped member 17 in the container having its open end above the level of the molten solder in the container in use and a support 18 for the rectifier assembly, the support being movable relative to the container to engage the phase plates with the cup shaped member and being movable further to depress the cup shaped member to dip the phase plates in the molten solder. A fixed crucible 11 is filled with solder 12 maintained molten by a heater and the solder is caused to flow upwardly in the container 13 fixed within the crucible by a rotating impeller 15 adjacent holes 14 in the base of the container, fins 16 on the inner walls of the container minimizing swirling. Cup shaped member 17 floats within the open end of the container 13 and a vertically movable support 18 for the rectifier assembly is above the member 17. The rectifier assembly (Fig. 3) comprises three terminal plates 23, 24, 25 on a central spindle, each carrying three diodes, and three phase plates each having three radially arranged resilient fingers 26a, 26b &c., one wire 29 from each diode being connected to its terminal plate and the other wire being passed through a hole in a respective resilient finger. The assembly is arranged in an apertured tray 19 which allows the resilient fingers to pass through but supports the terminal plates as in Fig. 3 and a frusto-conical cover 21 is screwed to the central spindle to engage the resilient fingers inwardly of the diode wires. The support is moved downwardly so that the member 17 engages the resilient fingers inwardly of the diode wires, further movement depressing the member 17 into the solder and bringing the diode wire/resilient finger connections into contact with the molten solder, the member 17 preventing solder flow along the fingers. |
