| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device which can effectively dissipate heat of a light emitting device which is generated accompanying increase of output. <P>SOLUTION: An LED element 14 of a flip chip type is mounted on a submount 13 which is mounted on a copper metal base part 11 which functions as a heat dissipator. A metal reflector 12 is joined to the metal base part 11 in which a trench for leading lead portions 16a, 16b outside is formed. In the trench, the lead portions 16a, 16b insulated with insulated sealing glasses 15a, 15b, 17a, 17b are arranged, and tip parts of the lead portions 16a, 16b are connected to an electrode and a wiring layer of the submount 13 in the state of mounting on a step-difference part of the submount 13. A reflecting surface 12a of a recessed part of an earthenware mortar shape is formed in the metal reflector 12 which functions as a reflector and a heat dissipating object, and the inside of the recessed part is filled with a sealing member 18 formed of a translucent resin etc. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
