| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device without causing an unfilled section of underfill, and to provide a circuit device capable of preventing cracks in a bump and a post electrode because of stress by the semiconductor device. <P>SOLUTION: The semiconductor device 2 has: the semiconductor device 2a; a terminal 3 formed with a prescribed pitch P between terminals on the lower surface of the semiconductor device 2a; and the columnar, metal post electrode 6 formed on the terminal 3. The post electrode 6 is composed of two mutually different metals, a side joined to the terminal 3 is composed of a first metal part 6a, and a side in which a solder bump 7 is formed is composed of a second metal part 6b. A dimension W1 in the width direction of the first metal part 6a is formed to be smaller than that W2 in the width direction of the second metal part 6b. <P>COPYRIGHT: (C)2009,JPO&INPIT |
