发明名称 Verfahren zum Behandeln der Oberflaeche einer Substratbahn
摘要 1,234,969. Laminating. SHOWA DENKO K.K. 24 Dec., 1968, No. 61423/68. Heading B5N. [Also in Divisions B2 and C3] The surface of a substrate is treated to improve its adhesivity to a plastics film and to improve its sealability by coating at least one side of the substrate sheet with a surface treating solution prepared by dissolving in an organic solvent a mixture of 99-50% by weight chlorinated polyethylene containing 40 to 75% by weight of chlorine and 1-50% by weight chlorinated polypropylene containing 25-35% by weight chlorine and bonded to the film. The substrate may be films of polypropylene, polyethylene, polyvinyl chloride, polyvinylidene chloride, polyesters, polyamides, polyvinyl alcohols, polyacrylonitrile, cellulose, aluminium foils, paper, cotton cloth, synthetic fibre cloth. The surface of the substrate may be treated with corona discharges or flame before or after coating. In the examples, polyethylene is extruded on to (2) a treated non-stretched polypropylene film and (3) a treated aluminium foil.
申请公布号 DE1900521(A1) 申请公布日期 1971.09.02
申请号 DE19691900521 申请日期 1969.01.07
申请人 SHOWA DENKO K.K. 发明人 OGAWA,MASAO;HAYASHI,SHIGEO;SATO,WASUKE;MORIMOTO,ICHIRO;HORIBE,TEISUKE;TAKEUCHI,GUNJI
分类号 C08J7/04;C09D123/28;D06M15/227 主分类号 C08J7/04
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