| 摘要 |
A semiconductor device of a film carrier package type in which wiring patterns formed on a flexible film are connected to electrodes that are used to make contacts with an external circuit and are formed on a semiconductor element or semiconductor elements mounted on the semiconductor device. The flexible film is designed so that the product of Young's modulus and the cube of film thickness of a material of the flexible film is smaller than 4.03x10<SUP>-4 </SUP>(Pa.m<SUP>3</SUP>), and that the inverse of the product of Young's modulus and thickness of the flexible film material is smaller than 4.42x10<SUP>-6 </SUP>(Pa<SUP>-1</SUP>.m<SUP>-1</SUP>). As a result, a semiconductor device and a display module using it are provided in which a substrate formed of a base film can be suitably bent, and in which sprocket holes of the base film will not be broken during transport. |
