| 摘要 |
1,256,077. Electrically insulating resin composition. MATSUSHITA ELECTRIC INDUSTRIAL CO. Ltd. 27 Nov., 1968 [30 Oct., 1968; 1 Nov., 1968], No. 46598/70. Divided out of 1,256,076. Heading C3B. Resin compositions, especially epoxy resins, comprise a filler of MgO which has been baked at not less than 1000‹ C. Baking may take place in an inert atmosphere, optionally in the presence of other fillers, e.g. SiO 2 . Uses.-Electrical insulation. |
