| 摘要 |
A method for producing reliable bonding bumps on large-scale array substrates and hybrid add-on components, the present invention is compatible with a wide variety of microcircuit components. Generally, the method envisions fabrication of bonding bumps by thin-film vacuum deposition through a mechanical mask. In particular, a first metal is deposited on a substrate to a desired thickness whereupon said first metal is then codeposited with a second metal. The bump is completed with the sole deposition of the second metal. A bump thus produced may be further processed to produce a "solder-dipped bump" or may be used in the thin-film state for component mounting.
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