| 发明名称 |
Retention module, heat sink and electronic device |
| 摘要 |
It is an object of the present invention to provide a retention module, a heat sink and electronic apparatus for effectively the heat from a chip set. The retention module for a CPU is provided with a heat sink for the chip set.
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| 申请公布号 |
US6992889(B1) |
申请公布日期 |
2006.01.31 |
| 申请号 |
US20020181425 |
申请日期 |
2002.11.05 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
KASHIWAGI TOSHIYUKI;KATOU HIROKATSU |
| 分类号 |
H05K7/20;H01L23/367;H01L23/40;H05K7/14 |
主分类号 |
H05K7/20 |
| 代理机构 |
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| 主权项 |
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