| 摘要 |
PURPOSE:To enable to bond and to fix a chip uniformly, and to prevent damage of the chip by a method wherein the chip is bonded and fixed to a circuit substrate applying gas pressure uniformly to the surface of the chip. CONSTITUTION:A plug 14 is opened, a chip 2 is held by a die collet 1 by vacuum absorption, and the chip 2 is positioned on a circuit substrate 3 in this condition. Then the die collet 1 is made to descend, the lower side of the chip 2 is made to come in contact with the circuit substrate 3, and the plug 14 is closed. Then the die collect 1 is transferred upward vertically by about 1/2 of thickness of the chip. After completion of transference, a plug 15 is opened, pressed air is introduced into an empty part 7 of the die collet, while the die collet is moved in the before and behind direction a, in the left and right direction b, and the chip is bonded and fixed to the substrate. When the progress to bond the chip to the substrate using adhesive resin or an Au-Si alloy 6 is completed, after the collet is drawn up releaving the chip on the substrate, the plug 15 is closed to complete die bonding. |
