Multilayer ceramic dielectric capacitor with PCB cleaning device - has space under dielectric leaves which permits cleansing of substrate but which prevents ingress of connecting wire

摘要

The interleaved dielectric leaves (10), coated partially with metal, are supported by metal end-pieces (11,12). These are soldered to metal sheets (21) on the insulating substrate (20) to make the electrical connections. A recess milled on the underside of the capacitor leaves space for cleansing of the substrate underneath (23) but is shallow enough to prevent accidental ingress of a substrate connecting wire. The process is applicable to leaves stacked horizontally or vertically. Preferably, the recess is in the region of the metallisations. To expose the largest possible area of substrate and to maintain a good mechanical rigidity, the size of the recess is pref. 1/20 to 1/5 the length of the capacitor.