Electronic circuit casing with multilayer capacitor - has base and hood with reactor realised on hood surface or within its thickness

摘要

The case has a base (1) on which the electronic circuit, realised on a silicon chip (3), is fixed, and a hood (2) fixed on the base so as to hermatically seal the circuit. The hood (2) has a capacitor on one of its faces or within its thickness. For the case of a capacitor on the upper surface of the hood, it may be realised by a metallisation (51) forming the first armature, a layer of dielectric material (52) and a second metallisation (53) forming the second armature of the capacitor. For the case of a capacitor realised within the thickness of the hood, the hood is formed of a number of layers alternately dielectric and conducting. The conducting layers of odd rank are connected electrically to form the second armature.