| 摘要 |
<p>The mounting consists of a column of stacked elements composed of semiconductor chips (12) inserted between electrodes (11) provided with heat dissipators which present a large surface to assist heat exchange with the medium in which they are submerged. The column of elements lies between two end plates (1,14) which are separated from the electrodes at each end of the column by means of insulators (9) and thrust washers (8). The end plates are connected to each other by means of at least three threaded rods (5) electrically insulated from the column by means of tubes (7). A screw (2) with a rounded tip passing axially through one of the end plates (1) allows the application to a point situated on the axis (17) of the column the required tightening force to the elements of the column. The elements are centred w.r.t. each other by means of guide pins (10) placed axially in orifices provided for this purpose in each facing surface of the column elements. The compression force between two column elements may be determined by means of a measuring gauge inserted between them.</p> |
