| 摘要 |
PURPOSE:To control the inside of a drying chamber and the inside of a wafer conveying part in liquid at a desired cleanliness based on monitored data, by providing fine-grain-density measuring devices in the drying chamber and the wafer conveying part in the liquid, in a wafer washing and drying apparatus. CONSTITUTION:The amount of high-purity pure water, which is supplied from a high-purity pure-water feeding part 17, and the amount of water, which is drained from a ring-shaped water draining part 21, are controlled in correspondence with the result of a counting monitor 19 for grains in liquid in a wafer conveying part 2 in the liquid in a wet chemical washing apparatus. The high- purity pure water 18 is always kept at high purity. A fine-grain-density measuring device 11, which measures the number of dust grains in the air in a drying chamber 1, is arranged in the drying chamber 11. The number of the dust grains in the drying chamber 1 is automatically counted. The amount of clean air 8, which is supplied from a clean air feeding part 7, and the amount of the air, which is exhausted from a ring shaped exhausting part 9, are controlled, and the cleanliness in the drying chamber is always kept at the normal level.
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