发明名称 |
Substrates for circuit panels |
摘要 |
Printed or hybrid circuits are formed on a metal substrate having an anodised surface layer, the substrate serving as a heat sink and the anodised layer forming a black body radiator. The circuit may be preformed or may be deposited directly on to the anodised layer. The substrate may be made of aluminium, titanium, tantalum, zirconium or magnesium. |
申请公布号 |
GB2206451(A) |
申请公布日期 |
1989.01.05 |
申请号 |
GB19870008457 |
申请日期 |
1987.04.09 |
申请人 |
REGINALD JOHN * GLASS;FREDERICK HERBERT * WELLS |
发明人 |
REGINALD JOHN * GLASS;FREDERICK HERBERT * WELLS |
分类号 |
H01L21/48;H01L23/14;H01L23/373;H05K1/02;H05K1/05;H05K1/09;(IPC1-7):H05K1/05 |
主分类号 |
H01L21/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|