发明名称 Substrates for circuit panels
摘要 Printed or hybrid circuits are formed on a metal substrate having an anodised surface layer, the substrate serving as a heat sink and the anodised layer forming a black body radiator. The circuit may be preformed or may be deposited directly on to the anodised layer. The substrate may be made of aluminium, titanium, tantalum, zirconium or magnesium.
申请公布号 GB2206451(A) 申请公布日期 1989.01.05
申请号 GB19870008457 申请日期 1987.04.09
申请人 REGINALD JOHN * GLASS;FREDERICK HERBERT * WELLS 发明人 REGINALD JOHN * GLASS;FREDERICK HERBERT * WELLS
分类号 H01L21/48;H01L23/14;H01L23/373;H05K1/02;H05K1/05;H05K1/09;(IPC1-7):H05K1/05 主分类号 H01L21/48
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