Hot bonding thermoplastic material to piezoelectric material - in transducer mfr., by surface fusing thermoplastic material

摘要

Hot bonding of the piezoelectric portion, provided with surface electrodes, and of the thermoplastic portion of a transducer is carried out by applying an h.f. voltage to the electrodes to induce, in the piezoelectric portion, mechanical oscillations of such amplitude that the resulting heat causes only the bonding face region of the thermoplastic material to be heated to a tacky condition. Cooling is carried out after the requisite bonding time. USE/ADVANTAGE - The process is useful in the mfr. of ultrasonic transducers of laminated structure. The process has low cost, does not require use of additional adhesive, does not affect the properties of the thermoplastic portion, provides good bonding and produces transducers with extremely high efficiency.