| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for efficiently manufacturing an SON (small outline non-lead package) semiconductor device. <P>SOLUTION: A plurality of linear lead frames 12 are arranged to be parallel to and spaced from each other, a plurality of semiconductor chips 20 comprising a plurality of electrode pads 22 are mounted to be spaced along the plurality of linear lead frames in the extending direction thereof, the plurality of electrode pads and the plurality of linear lead frames are connected by bonding wires 40, sealing parts 50 for sealing the semiconductor chips and the bonding wires and interframe sealers 50d exposed to the outside of the sealers for filling gaps between the adjacent linear lead frames are formed, a groove 60 is formed to cut all the linear lead frames positioned directly under the semiconductor chips, in a direction perpendicular with respect to the lead frame extension direction, and the lead frames and the interframe sealing parts exposed between the plurality of semiconductor chips are cut into individual semiconductor devices 10. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
