Method for making dual gauge leadframe

摘要

A leadframe ( 20 ) for a semiconductor device includes a first leadframe portion ( 12 ) having a perimeter that defines a cavity ( 16 ) and a plurality of leads ( 14 ) extending inwardly from the perimeter and a first thickness. A second leadframe portion ( 18 ) is attached to the first leadframe portion ( 16 ). The second leadframe portion ( 18 ) has a die paddle ( 20 ) received within the cavity ( 16 ) of the first leadframe portion ( 12 ). The second leadframe portion ( 18 ) has a second thickness that is greater than a thickness of the first leadframe portion ( 12 ). Such a dual gauge leadframe is suitable especially for high power devices in which the die paddle acts as a heat sink.