| 摘要 |
PURPOSE:To perform reliably a resin injection, to form lead support parts having sufficient elastic repulsive forces reliably and to prevent sag of inner lead parts by a method wherein a plurality of resin circulating holes for making a resin pass through are dispersedly formed in the lead arrangement region of each lead support part. CONSTITUTION:In order to seal a semiconductor device 28 mounted on a tape for tape carrier use with a resin 29, the device 28 is encircled by a metal mold along with the peripheral edge parts of center device holes 23 of lead support parts 25 and the resin 29 is injected from the side of one surface, such as the side of the upper surface, of each lead support part 25 along crosslinking parts 26. In this case, as resin circulating holes 31 are formed in each lead support part 25, the resin 29 creeps sufficiently from a top force to a bottom force through the holes 31 to extend to all the corners of the bottom force and there is no such a trouble as a resin uninjected part 10 is formed. Moreover, the parts 25 are never curved downward and sag of inner lead parts 27a can be prevented. |
