| 摘要 |
PURPOSE: To provide a printed-wiring board extremely suppressing the manufacturing cost in a simple alignment in the manufacturing step by a method wherein respective specific base film, coverlays, prepregs or bonding sheet and conductor circuits are provided. CONSTITUTION: The four layer type printed-wiring board is provided with a base film 10 with conductor circuits 12, 13 formed on both surfaces, coverlays 21, 22 formed by entirely covering both surfaces of the base film 10 for curing a bonding sheet in semicured state comprising polyimide base resin, furthermore, a pair of prepregs 14, 15 or bonding sheet having openings 16, 17 respectively laminated on the coverlays 21, 22 as well as the conductor circuits 12, 13 formed by etching the copper foils 31, 32 entirely covering them. Besides, respective prepregs 14, 15 or bonding sheet are arranged so that the positions of the openings 16, 17 may correspond to each other. |
