| 摘要 |
PURPOSE: To increase the adhesive strength between a resin and a metallic layer and to form the metallic layer having the sufficient volume by providing the porous resin and the metallic layer capable of being chemically bonded with the porous resin and coating the porous resin with the metallic layer. CONSTITUTION: The resin is etched at first to chemically bond with a metal. The etching is executed with either one of a high concn. alkali, a high concn. chromic acid.sulfuric acid, a high concn. sulfuric acid.nitric acid and ammonium hydrogen fluoride-nitric acid. The metal and the resin are chemically bonded with each other at the time of treating the etched resin with a metallic salt solution. The metallic layer is composed of a metal catalyst containing, for example, at least one of Pd and Sn and a metal for electroless treatment, which is formed by using the metal catalyst as a nucleus. As a result, since the adhesive strength of the resin to the metallic layer and also the covering volume of the metal are increased, the resin film is made sufficiently conductive. |
