发明名称 Printing wiring board and method of producing the same and capacitor to be contained in printed wiring board
摘要 Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large thickness. Therefore, the thickness of the printed circuit board does not become large.
申请公布号 US6876554(B1) 申请公布日期 2005.04.05
申请号 US20010830361 申请日期 2001.04.25
申请人 IBIDEN CO., LTD. 发明人 INAGAKI YASUSHI;ASAI MOTOO;WANG DONGDONG;YABASHI HIDEO;SHIRAI SEIJI
分类号 H01L21/48;H01L23/498;H01L23/50;H01L23/64;H01L25/16;H05K1/02;H05K1/18;H05K3/46;(IPC1-7):H05K1/18 主分类号 H01L21/48
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