| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a chip solid electrolytic capacitor in which formation of an electrode surface on a cathode side and connection of a terminal part are easily performed. SOLUTION: A resin molding die is formed by providing a pull-out part for an anode lead-out wire of the resin molding die, for molding of an outer package of a capacitor element 1, with a stepped dent, and providing a cathode lead-out part on the opposite side of the anode lead-out wire with a pyramidal or conical-shaped injection part 7a. The capacitor element 1 is arranged in the die, and a resin is charged in it so as to be molded rectangularly inn a transfer mold method, and then a pyramid or conical-shaped outer packaging resin part is broken and removed, to expose the cathode layer of the capacitor element 1. |
