| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent an occurence of corrosion caused by scratches at the time of inspection of nonconnection pad in a semiconductor device having a semiconductor chip on which a wire connection pad and a nonconnection pad are formed. <P>SOLUTION: The semiconductor device comprises a semiconductor chip 10, and a metal pad 11 formed on the chip 10. The pad 11 comprises a wire pad 11a connected to a metal bonding wire 30, and a nonconnection pad 11b not connected to the wire 30. The surface of the pad 11b is covered by a bump-shaped coating member 14 formed by a primary bonding in the wire bonding. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
