| 摘要 |
PROBLEM TO BE SOLVED: To release and relax a residual stress of a tension generated at a ceramic board in a connecting step, to upgrade a connecting strength and to suppress a crack against application of a heat cycle or the like by implanting particles of higher hardness than that of a metal circuit board in an outer edge of the board. SOLUTION: The ceramic circuit board 3 is obtained by directly connecting a ceramic board 1 to a metal circuit board 2. That is, the board 2 and a copper member are applied, the board 2 is disposed to be brought into contact with the board 1, heated to a temperature of an eutectic temperature or higher of copper and copper oxide at a melting point or lower of the copper. Thus, an eutectic crystal liquid phase of Cu-Cu2O is generated at a connecting surface, a surface of the board 1 is leaked by the liquid phase, and then the liquid phase is cooled, and solidified to directly connect the board 1 to the board 2. Thus, a residual stress of a tension generated in the board 1 after the connection can be effectively, efficiently released and relaxed.
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