| 摘要 |
PROBLEM TO BE SOLVED: To provide a local soldering apparatus capable of obtaining the uniform pre-heating effect and cooling effect at a plurality of local points. SOLUTION: A first heating means 12 for uniformly pre-heating a work W at the temperature lower than the melting point of a solder, and a local soldering means 13 which feeds the molten solder to a plurality of local points of the pre-heated work W to implement the local soldering are provided in a chamber 11. In addition, a second heating means 14 for supplementally heating the work at the temperature lower than the melting point of the solder and a cooling means 15 for uniformly cooling the soldered work W are included. A transferring means 16 for transferring the work W to at least the first heating means 12, the local soldering means 13, the second heating means 14 and the cooling means 15, is arranged. The uniform pre-heating effect and cooling effect are obtained by heating the temperature-dropped work W by the second heating means 14.
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