发明名称 |
METHOD FOR TREATING COPPER CHLORIDE-CONTAINING WASTE ETCHING SOLUTION, TREATING AGENT AND METHOD FOR RECOVERING COPPER |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for efficiently treating a copper chloride- containing waste etching solution with a reduced amount of sludge generated. SOLUTION: In the method for treating a copper chloride-containing waste etching solution, the pH of the solution to be treated is adjusted to the range of 5-14 in the presence of (i) phosphate ions, (ii) calcium ions, (iii) iron ions and (iv) a carboxyl-containing hydrophilic high polymer and/or its hydrolyzate and dissolved copper ions are precipitated as a slightly soluble material.</p> |
申请公布号 |
JP2002153889(A) |
申请公布日期 |
2002.05.28 |
申请号 |
JP20000353449 |
申请日期 |
2000.11.20 |
申请人 |
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL & TECHNOLOGY;TATSUMI KENJI;WADA SHINJI;MITSUBISHI CORP |
发明人 |
TATSUMI KENJI;WADA SHINJI;YUGAWA YASUHIRO |
分类号 |
C02F1/56;C02F1/62;C22B3/44;C22B15/00;(IPC1-7):C02F1/62 |
主分类号 |
C02F1/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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