| 摘要 |
PROBLEM TO BE SOLVED: To efficiently deposit a plating metal layer to the side conductor of the wiring board obtained by dividing the batch-process wiring board. SOLUTION: In the batch-process wiring board, multiple wiring board areas 11 are arranged in a flat mother board 10 by a plurality of rows. Notches 12 passing through the mother board 10 are formed from the other end side of the mother board 10 on a boundary dividing the respective rows so that one end side of the mother board 10 becomes a connected state. Side conductors 3 passing through the mother board 10 are exposed to the sides of the respective wiring board areas 11 in the notches 12.
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