COMPOSITION FOR SEALING RESIN

摘要

PROBLEM TO BE SOLVED: To provide a composition for resin suitable for use in sealing a semiconductor device and a liquid crystal panel that can be cured with a small irradiation amount of an active energy ray or by heat treatment within a short period of time and is excellent in various physical properties. SOLUTION: The composition which comprises a compound having at least one oxetanyl group and at least one epoxy group in the same molecule can be cured with a small irradiation amount of an active energy ray or at a low temperature within a short period of time and can exhibit sealing properties excellent in various physical properties.