发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP AND MANUFACTURING APPARATUS
摘要 PROBLEM TO BE SOLVED: To enable a container used when a semiconductor chip is manufactured by cutting a rod-shaped semiconductor crystal to be repeatedly used, and further to realize an increased life of tools for cutting. SOLUTION: First, the rod-shaped semiconductor crystal 1 is inserted into a separator 2 set in a frame 4 and the frame 4 is stored in the container containing water. Water is then frozen to be ice 11. Subsequently, the container is heated, and the ice between the inside of the container and the outside of the frame 4 is melt and the frame 4 is taken out from the container. The rod- shaped semiconductor crystal 1 in the frame 4 taken out is cut in the direction perpendicular to the longitudinal direction with its periphery ice 11. The ice is melted and the semiconductor chip is separated from the separator 2.
申请公布号 JP2002203817(A) 申请公布日期 2002.07.19
申请号 JP20000401857 申请日期 2000.12.28
申请人 MORIX CO LTD 发明人 MORINO ISAO
分类号 B28D5/02;H01L21/304;(IPC1-7):H01L21/304 主分类号 B28D5/02
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