发明名称 METHOD FOR FORMING THIN FILM, AND SUBSTRATE USING IT FOR ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To further improve a peel strength of a plated underlayer even to a substrate made of a liquid crystal polymer added with no filler. SOLUTION: This thin-film-forming method includes etching a substrate material in an etching step 32 by immersing it in a compound solution having an amino group or a thiol group as a functional group in endpoints of the molecule, such as a prescribed ethylenediamine solution, for a predetermined period; ultrasonically cleaning the etched substrate material in a polar organic solvent such as a N-methylpyrrolidinone (NMP) solution for ten minutes, in a cleaning step 34; and ultrasonically cleaning the ultrasonically cleaned substrate material in ultrapure water for ten minutes. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005232501(A) 申请公布日期 2005.09.02
申请号 JP20040040509 申请日期 2004.02.17
申请人 UNIV KANAGAWA;YAMAICHI ELECTRONICS CO LTD 发明人 SATO YUICHI;UMEHARA KOJI;SHINPO KAZUKI;YONEZAWA AKIRA
分类号 C23C18/28;C23C18/26;H05K3/18;(IPC1-7):C23C18/28 主分类号 C23C18/28
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