发明名称 |
METHOD FOR FORMING THIN FILM, AND SUBSTRATE USING IT FOR ELECTRONIC EQUIPMENT |
摘要 |
PROBLEM TO BE SOLVED: To further improve a peel strength of a plated underlayer even to a substrate made of a liquid crystal polymer added with no filler. SOLUTION: This thin-film-forming method includes etching a substrate material in an etching step 32 by immersing it in a compound solution having an amino group or a thiol group as a functional group in endpoints of the molecule, such as a prescribed ethylenediamine solution, for a predetermined period; ultrasonically cleaning the etched substrate material in a polar organic solvent such as a N-methylpyrrolidinone (NMP) solution for ten minutes, in a cleaning step 34; and ultrasonically cleaning the ultrasonically cleaned substrate material in ultrapure water for ten minutes. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005232501(A) |
申请公布日期 |
2005.09.02 |
申请号 |
JP20040040509 |
申请日期 |
2004.02.17 |
申请人 |
UNIV KANAGAWA;YAMAICHI ELECTRONICS CO LTD |
发明人 |
SATO YUICHI;UMEHARA KOJI;SHINPO KAZUKI;YONEZAWA AKIRA |
分类号 |
C23C18/28;C23C18/26;H05K3/18;(IPC1-7):C23C18/28 |
主分类号 |
C23C18/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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