发明名称 |
METHOD FOR CURING THERMOSETTING RESIN |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for curing a thermosetting resin capable of suppressing generation of a volatile organic substance (VOC) during curing while maintaining curing properties of a thermosetting resin. SOLUTION: The method for curing a thermosetting resin comprises adding 0.01-10 pts.wt. of an acetoacetic acid amide to 100 pts.wt. of a thermosetting resin and curing the resulting mixture. A thermosetting resin composition is prepared by adding 0.01-10 pts.wt. of an acetoacetic acid amide to 100 pts.wt. of a thermosetting resin. An inhibitor to suppress the generation of a volatile organic substance during curing of a thermosetting resin comprises an acetoacetic acid amide. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005232324(A) |
申请公布日期 |
2005.09.02 |
申请号 |
JP20040043833 |
申请日期 |
2004.02.20 |
申请人 |
NOF CORP |
发明人 |
HAYASHI MASAKI;KOJIMA TATSUIE;ICHIKAWA HIDEJI |
分类号 |
C08L67/06;C08K5/20;C08L63/10;(IPC1-7):C08L67/06 |
主分类号 |
C08L67/06 |
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