| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive which can mitigate against thermal stress even when a heat-conductive filler is used in the heat-conductive adhesive, and furthermore an electronic part obtained by bonding a semiconductor element to a radiating member with this adhesive to prevent peeling of the bonded interface due to thermal stress and cracking in the glue line. SOLUTION: The adhesive 1 has a stretch fabric entangled with heat-conductive fibers 2 such as metallic fibers and heat-conductive ceramic fibers in the form of curved lines and a thermosetting resin 3 with which this stretch fabric is impregnated, and is made bondable to an adherend by this thermosetting resin 3. COPYRIGHT: (C)2005,JPO&NCIPI
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